INTAMSYS FUNMAT PRO 610HT

Specs
- Technology: Fused Filament Fabrication (FFF)
- Material Type: High-performance thermoplastics and composites (open-material system)
- Material Format: 1.75 mm (optionally 2.85 mm) filament
- Material Names: PEEK, PEEK-CF, PEEK-GF, PEKK, ULTEM™ (PEI), PPSU, PC, PC alloys, PA, PA-CF, ABS, ASA, HIPS, TPU, PVA, metal/glass-filled, ESD-safe, and more (Compatible with open-source materials)
- Build Volume:
- FUNMAT PRO 610HT: 610 x 508 x 508 mm (24 x 20 x 20 in)
- FUNMAT PRO 410: 12 x 12 x 16 in
- FUNMAT PRO 310 NEO: 10 x 12 x 10 in (single nozzle), 10 x 10 x 10in (dual nozzle)
- Price: Quote-based; some listings suggest ~US$124,995+
- Resolution: XY ~12 µm, Z ~1.25 µm; Layer thickness 0.05–0.5 mm
- Print Speed: XY up to ~500 mm/s; Z up to ~300 mm/s
- Temperatures:
- Chamber: up to 300 °C
- Build plate: up to 300 °C
- Extruders: up to 500 °C
- Extruders: Dual nozzles; all-metal hot ends; auto-cleaning; water/air cooling; filament jam/run-out sensors
- Build Platform: Heated vacuum absorption bed with auto-leveling
- Connectivity & Control: Touchscreen, USB, Wi-Fi, Ethernet; remote monitoring; software: INTAMSUITE, Cura, Simplify3D (STL/OBJ)
- Safety & Certifications: FCC, CE; power-failure recovery; overheat protection
- Power & Dimensions: ~1500 W, 220 V 30 A single-phase or 380 V three-phase; size ≈1710 × 1390 × 2035 mm; weight ~1450 kg
- Links: INTAMSYS FUNMAT PRO 610HT
Description
The INTAMSYS FUNMAT PRO 610HT is an industrial-grade 3D printer built for high-performance polymers and composites. Its actively heated chamber (300 °C), dual 500 °C extruders, and 300 °C vacuum bed allow reliable processing of advanced materials like PEEK, PEKK, and ULTEM™. With its large build volume (610 × 508 × 508 mm), it can produce aerospace-scale components or multiple production parts in one cycle. Features like liquid-cooled hot ends, auto-bed leveling, safety systems, and open-material compatibility make it a versatile choice for aerospace, automotive, and manufacturing industries requiring strength, thermal resistance, and dimensional accuracy.